专利名称：ELECTRONIC ASSEMBLY WITH IMPROVED
GROUNDING AND EMI
发明人：FERCHAU, Joerg, U.,KOTYUK, Kenneth,
A.,DIAZ, Randall, J.
申请号：EP92917712.9申请日：19920806公开号：EP0598028B1公开日：19981125
摘要：(2) including a set of electronic electronic module (8) on a rear plane (4) having aground plane (48) that is used to perform an earthing and protection againstelectromagnetic interference. the module includes a conductive chassis (10) having afloating chassis plate (12).the connector (18) mounted on the chassis plate mating withthe connectors (20) installed on the rear plane, when the module comes in contact withthe rear plane.a grounding clip (24) mounted on the chassis plate comes into contact witha mounting assembly (42) extending from the elastic arm, and includes a rearwardextending laterally by insulating clamp (30) relative to the chassis.the grounding clip iselectrically connected to the ground plane of the plate of the frame (22), so that the twoplans for the earth, are isolated from the chassis by means of a pair of grounding. theback plate includes a shield (50) comprising connectors and connected to the groundplane.a driver (54) attached to the frame mates mechanically and electrically to thegrounding plate.
申请人：TANDEM COMPUTERS INC
地址：US
国籍：US
代理机构：Ayers, Martyn Lewis Stanley
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