专利名称：Multilayered printed wiring board and its
manufacture
发明人：Yasue, Toshihiko,Hiramatsu, Yasuji,Yano,
Hideki,Ishitani, Yoshifumi,Kawamura,Yoichiro,Murase, Hideki,Suzuki,Ayumi,Kawade, Masato
申请号：EP06017887.8申请日：19960329公开号：EP1720392A2公开日：20061108
专利附图：
摘要：It is to provide a multilayer printed circuit board having excellent resolution,interlaminar insulation property and resistance to cool-heat shock without formingunevenness on the surface and lowering peel strength even if the thickness of the resininsulating layer is thin. The invention proposes a multilayer printed circuit boardcomprising an upper conductor circuit layer (6), a lower conductor circuit layer (5) and a
resin insulating layer (2,3) electrically insulating both the conductor circuit layers, in whichthe resin insulating layer is a composite layer comprised of an insulating layer (2) madefrom a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer andan adhesive layer (3) for electroless plating made from a heat-resistant resin as an upperlayer.
申请人：IBIDEN CO., LTD.
地址：1, Kanda-cho 2-chome Ogaki-shi, Gifu 503-0917 JP
国籍：JP
代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
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