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Method of drying wafers

2020-06-01 来源:独旅网
专利内容由知识产权出版社提供

专利名称:Method of drying wafers发明人:Wen-Chang Kuo,Szu-Yao Wang申请号:US10036887申请日:20020104公开号:US06598314B1公开日:20030729

专利附图:

摘要:A new method and apparatus is provided for the cleaning and drying of a wafer.An IPA vapor is created using an ultrasonic nebulizer that can be operated at a relativelylow temperature. The water and the IPA that is used by the cleaning and drying processwill be heated and evaporated using energy supplied by a microwave source of energy.

申请人:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY

代理人:George O. Saile,Stephen B. Ackerman

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